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| DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D121 PRLL4001; PRLL4002 Rectifiers Product specification Supersedes data of November 1993 1996 Jun 10 Philips Semiconductors Product specification Rectifiers FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Shipped in 8 mm embossed tape * Smallest surface mount rectifier outline. handbook, 4 columns PRLL4001; PRLL4002 DESCRIPTION Cavity free cylindrical glass package through ImplotecTM(1) technology. (1) Implotec is a trademark of Philips. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. k a MAM061 Marking code PRLL4001: 4001. Marking code PRLL4002: 4002. Fig.1 Simplified outline (SOD87) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM PARAMETER repetitive peak reverse voltage PRLL4001 PRLL4002 VR continuous reverse voltage PRLL4001 PRLL4002 IF(AV) average forward current averaged over any 20 ms period; Ttp = 105 C averaged over any 20 ms period; Tamb = 65 C; see Fig.2 IFRM IFSM Tstg Tj repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature half sinewave; 60 Hz - - - - - - -65 -65 50 100 V V - - 50 100 V V CONDITIONS MIN. MAX. UNIT 1.60 A 0.68 A 10 20 +175 +175 A A C C 1996 Jun 10 2 Philips Semiconductors Product specification Rectifiers ELECTRICAL CHARACTERISTICS Tj = 25 C; unless otherwise specified. SYMBOL VF VF(AV) IR IR(AV) PARAMETER forward voltage full-cycle average forward voltage reverse current full-cycle average reverse current IF(AV) = 1 A VR = VRmax VR = VRmax; Tamb = 100 C PRLL4001; PRLL4002 CONDITIONS IF = 1 A; see Fig.3 MAX. 1.1 0.8 10 50 30 V V UNIT A A A VR = VRRMmax; Tamb = 75 C THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 m, see Fig.4. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS VALUE 30 150 UNIT K/W K/W 1996 Jun 10 3 Philips Semiconductors Product specification Rectifiers GRAPHICAL DATA PRLL4001; PRLL4002 handbook, halfpage 1.0 MBH384 handbook, halfpage 10 MBH385 IF(AV) (A) IF (A) 0.5 1 (1) (2) (3) 0 0 100 Tamb (C) 200 10-1 0 0.5 1 VF (V) 1.5 (1) Tamb = 100 C. (2) Tamb = 20 C. (3) Tamb = -50 C. Fig.2 Maximum average forward current as a function of ambient temperature. Fig.3 Forward current as a function of forward voltage; typical values. 50 4.5 50 2.5 1.25 MSB213 Dimensions in mm. Fig.4 Printed-circuit board for surface mounting. 1996 Jun 10 4 Philips Semiconductors Product specification Rectifiers PACKAGE OUTLINE PRLL4001; PRLL4002 handbook, full pagewidth 3.5 0.3 0.2 OD= 2.05 0.05 MBA505 O D1 = 1.9 0.1 Dimensions in mm. Fig.5 SOD87. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 1996 Jun 10 5 |
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